Nanjing Zhongjiang New Material Technology Co., Ltd. made a dazzling appearance at the CPCA 2025 International Electronic Circuit Exhibition, 

attracting industry attention with its high-end copper-clad ceramic substrates!

From October 28th to 30th, Nanjing Zhongjiang New Material Technology Co., Ltd. (hereinafter referred to as "Zhongjiang New Material") participated in the "2025 Electronic Semiconductor Industry Innovation and Development Conference & International Electronic Circuit (Greater Bay Area) Exhibition" (CPCA Show Plus 2025), led by its General Manager, Mr. Lin Xiaoguang. Themed "Innovation Drives, Future Shines", the exhibition was grandly held at the Shenzhen International Convention and Exhibition Center (Bao'an New Venue), gathering 400 high-quality suppliers from around the world and nearly 50,000 professional visitors.

Zhongjiang New Materials, leveraging its cutting-edge products and deep industry expertise, successfully attracted the attention of numerous customers and partners from both domestic and overseas markets at the 8B16-3 booth. During the exhibition, the company's staff enthusiastically introduced product and technical information to every visitor, engaging in in-depth discussions with customers and partners from various countries and regions, jointly exploring industry trends and cooperation opportunities.

At the exhibition, the company highlighted its three core product series: DBC (Direct Bonded Copper), DBA (Direct Bonded Aluminum), and AMB (Active Metal Brazed) ceramic substrates. These products, as key basic materials for power semiconductor packaging, are widely used in high-reliability fields such as new energy vehicles, photovoltaic inverters, aerospace, rail transportation, and white goods.

This exhibition not only showcases the hard power of Zhongjiang New Materials in the field of copper-clad ceramic substrates, but also highlights its mission of "leading the future of new materials". As the global semiconductor industry chain gathers in China, the company will continue to invest in research and development, optimize production capacity, and help solve "bottleneck" technical problems, providing strong momentum for the process of China's semiconductor material independence.