Nanjing Zhongjiang New Materials Technology Co., Ltd has achieved another success! Recently, our company's "Third-generation AMB Ceramic Copper-clad Substrate for Power Semiconductor Packaging" product has been approved for inclusion in the 31st batch of the Jiangsu Province's New Technology and New Product Catalogue for Key Promotion and Application.
Our company has long been dedicated to the research, development, production, and application of ceramic copper-clad substrates for power semiconductor packaging. In recent years, the explosive growth of new energy vehicles has driven the large-scale application of third-generation power semiconductors, and the continuous improvement of power density has raised higher requirements for packaging materials. After years of dedicated independent research and product iteration, our company's "AMB ceramic copper-clad substrate" can significantly enhance the service life of power semiconductors, not only promoting the upgrading of related industries, but also achieving international advanced levels in various performance indicators, thus changing the domestic dependence on imported AMB ceramic copper-clad substrates.
Our company will continue to increase investment in various management and R&D areas, and "persevere in deep cultivation and strive for long-term success" in the semiconductor field!
